Different than semiconductor molding applications, system-in-package
encapsulation requires the encapsulation of multiple components with varying
sizes, geometries and complexities.
Molding compounds must be low stress encapsulants as well as be thermally
conductive to dissipate the heat the devices generate.
Key Application Considerations:
Many
components with various sizes and geometries
Must
pass a minimum of MSL 4
Device
generates heat that must be dissipated
Key Material Properties:
Thermal
conductivity: ≥ 2.5 W/m∙K
Glass
Transition Temperature (Tg) must be higher than 135°C